Professor

Phone: 00862787556835

Email: tlshi@hust.edu.cn

Academic Areas: MEMS、precision instruments and equipments、signal analysis

Shi Tielin, born in January 1964, member of Chinese communist party, professor, doctoral supervisor, Yangtze River Scholar Distinguished Professor, secretary of the Mechanical Engineering in Huazhong University of Science and Technology. Prof. Shi Tielin received his BEng degree (1985) and MEng degree (1988) from Xi’an Jiaotong University, Ph.D. degree (1991) from Huazhong University of Technology, and completed his post-doctoral research in 1993. Then he joined the faculty of Huazhong University of Science and Technology. Prof. Shi Tielin is currently the standing director of Chinese Society of Vibration Engineering, director of dynamic signal analysis professional committee for Chinese Society of Vibration Engineering, vice director of Chinese Society of Fault Diagnosis Engineering, and the member of Chinese Society of Micro/nano Technology. In addition, he is an associate editor of the English journal "Frontiers of Mechanical Engineering in China ", and also an editorial board member for several Chinese mechanical engineering journals. Prof. Shi was awarded the 1st (of theory) and 2nd (of application) class Award of S&T Progress issued by National Education Commission, the 1st Award of S&T Progress issued by Ministry of Industry, the 3rd Award of National S&T Progress, the Youth S&T Award of China, Excellent post-doctor of China, the May 4th Youth Prize of Hubei Province, the Outstanding Youth S&T Award issued by Chinese Society of Mechanical Engineering, the first batch of national candidate of "New Century Excellent Talents Project", etc. Prof. Shi has taken charge of more than 40 projects, including National 973 program, National 863 program, Grand Project of National Natural Science Foundation of China, projects of National Natural Science Foundation, Military 973 program, preliminary research of assembly project and so on. He has published more than 250 papers with 100 papers indexed by SCI, and filed more than 80 invention patents among which 50 patents have been granted.

Academic Degrees

Prof. Shi Tielin received his BEng degree (1985) and MEng degree (1988) from Xi’an Jiaotong University, Ph.D. degree (1991) from Huazhong University of Technology, and completed his post-doctoral research in 1993. Then he joined the faculty of Huazhong University of Science and Technology.

Selected Publications

[1] Wei Zhu, Tielin Shi (史铁林*), Zirong Tang, Bo Gong, Guanglan Liao, John Tully, Dynamic selective etching: a facile route to parabolic optical fiber nano-probe, Optics Express (IF 3.54), 21(6), pp. 6919–6927, 2013

[2] Shuang Xi, Tielin Shi (史铁林*), Dan Liu, Liangliang Xu, Hu Long, Wuxing Lai, Zirong Tang,Integration of carbon nanotubes to three-dimensional C-MEMS for glucose sensors,Sensors and Actuators A: Physical (IF 1.84),198 (2013) 15-20

[3] Shuang Xi, Tielin Shi (史铁林*), Lei Zhang, Dan Liu, Wuxing Lai, Zirong Tang, Highly visible-light reflective SiOxNy nanowires for bright-white reflector applications, Thin Solid Films (IF 1.60), 529, pp115–118, 2013

[4] Li Jiang, Tielin Shi (史铁林*), Jianping Xuan. Fault diagnosis of rolling bearings based on Marginal Fisher analysis. Journal of Vibration and Control (IF 1.96). DOI: 10.1177/1077546312463747

[5] Biao Chen, Tielin Shi (史铁林*), Mo Li, Zhaobo Zhang, Zhijing Zhu and Guanglan Liao. Laser Welding of Zr41Ti14Cu12Ni10Be23 Bulk Metallic Glass: Experiment and Temperature Field Simulation. Advanced Engineering Materials (IF 1.61), 2013, 15, No. 5: 407-413

[6] Q. Xia, T. L. Shi (史铁林*), S. Y. Liu, M. Y. Wang. Shape and topology optimization for tailoring stress in a local region to enhance performance of piezoresistive sensors, Computers and Structures (IF 1.51), 2013, 114–115:98–105.

[7] Q. Xia, T. L. Shi (史铁林*), M. Y. Wang. A method for shape and topology optimization of truss-like structure, Structural and Multidisciplinary Optimization (IF 1.73), 2013, 47:687-697.

[8] K. Wang, T.L. Shi (史铁林*), G.L. Liao, Q. Xia,Image registration using a point-line duality based line matching method, Journal of Visual Communication and Image Representation (IF 1.19), 2013, 24:615–626. SCI,

[9] Bo Sun, Tielin Shi (史铁林*), Wenjun Sheng, and Guanglan Liao. Controlled Fabrication of Silicon Nanowires via Nanosphere Lithograph and Metal Assisted Chemical Etching. Journal of Nanoscience and Nanotechnology (IF 1.15), Vol. 13, 5708–5714, 2013

[10]Q. Xia, M. Y. Wang, T. L. Shi (史铁林*). A move limit strategy for level set based structural optimization, Engineering Optimization (IF 0.96), http://dx.doi.org/10.1080/0305215X.2012.720681.

[11]WENJUN SHENG, TIELIN SHI (史铁林*), ZHENGCHUN PENGa, BO SUN, GUANGLAN LIAO. Fabrication of antireflective silicon nanowires array. Journal of Optoelectronics And Advanced Materials (IF 0.52) Vol. 15, No.3 - 4, March – April 2013, p. 133 - 138

[12]Liu Dan, Shi Tielin (史铁林*), Xi Shuang, Lai Wuxing, Liu Shiyuan, Li Xiaoping, Tang Zirong,Concentration gradient induced morphology evolution of silica nanostructure growth on photoresist-derived carbon micropatterns, Nanoscale Research Letters (IF 2.52), 7, pp1-9, 2012

[13]Xiangning Lu, Tielin Shi (史铁林*), Qi Xia, Guanglan Liao. Thermal conduction analysis and characterization of solder bumps in flip chip package, Applied Thermal Engineering (IF 2.13) 36 (2012) 181-187

[14]Lei Zhang, Tielin Shi (史铁林*), Zirong Tang, Dan Liu, Shuang Xi,Stress-driven and Carbon-assisted Growth of SiOxNy Nanowires on Photoresist-derived Carbon Microelectrode, IEEE Journal of Microelectromechanical Systems (IF 2.09), 21(6), pp1445-1451, 2012.

[15]Xi Shuang, Shi Tielin (史铁林*), Xu Liangliang, Tang Zirong, Liu Dan, Li Xiaoping, Liu Shiyuan,Metal-Catalyst-Free Synthesis and Characterization of Single-Crystalline Silicon Oxynitride Nanowires,Journal of Nanomaterials (IF 1.54), 2012, pp1-8, 2012.

[16]Junchao Liu, Tielin Shi (史铁林*), Ke Wang, Zirong Tang, Guanglan Liao. Defect detection of flip-chip solder joints using modal analysis, Microelectronics Reliability (IF 1.14) 52 (2012) 3002–3010

[17]JIANG Xuan, SHI TieLin (史铁林*), ZUO HaiBo, YANG XueFeng, WU WenJun & LIAO GuangLan. Investigation on color variation of Morpho butterfly wings hierarchical structure based on PCA. SCIENCE CHINA Technological Sciences (IF 1.18), 2012, Vol.55 No.1: 16–21

[18]Junchao Liu, Tielin Shi (史铁林*), Qi Xia, Guanglan Liao. Flip chip solder bump inspection using vibration analysis. Microsyst Technol (IF 0.83) (2012) 18:303–309

[19]Dan Liu, Tielin Shi (史铁林*), Zirong Tang, Lei Zhang, Shuang Xi, Xiaoping Li, Wuxing Lai. Carbonization-assisted integration of silica nanowires to photoresist-derived three-dimensional carbon microelectrode arrays. Nanotechnology (IF 3.84) 22: 465601-465608 (2011)

[20]Shuang Xi, Tielin Shi (史铁林*), Lei Zhang, Dan Liu, Wuxing Lai, Zirong Tang. Growth of highly bright-white silica nanowires as diffusive reflection coating in LED lighting. Optical Express (IF 3.54), 19: 26507-26514 (2011)

[21]Wei Ma, Tielin Shi (史铁林*), Zirong, Tang, Shiyuan Liu, Rizwan Malik, Lei Zhang. High-throughput dielectrophoretic manipulation of bioparticles within fluids through biocompatible three-dimensional microelectrode array. Electrophoresis (IF 3.26) 32: 494-505 (2011)

[22]Lei Zhang, Tielin Shi (史铁林*), Zirong Tang, Dan Liu, Shuang Xi, Xiaoping Li, Wuxing Lai. Carbon-assisted growth and high visible-light optical reflectivity of amorphous silicon oxynitride nanowires. Nanoscale Research Letters (IF 2.52) 6: 469-474 (2011)

[23]Q. Xia, T. L. Shi (史铁林*), M. Y. Wang, S. Y. Liu. Simultaneous optimization of cast part and parting direction using level set method, Structural and Multidisciplinary Optimization (IF 1.73), 2011, 44:751–759.

[24]Yang Gao, Qi Xia, Guanglan Liao, Tielin Shi (史铁林*). Sensitivity Analysis of a Bioinspired Refractive Index Based Gas Sensor. Journal of Bionic Engineering (IF 1.14) 8 (2011) 323–334

[25]Rizwan Malik, Tielin Shi (史铁林*), Zirong Tang, Shiyuan Liu, Effect of ultra violet process and annealing on reliability in low temperature silicon wafer direct bonding, Advanced Science Letters (IF 1.253), 2011,4(3):774-780.

[26]Peng, P; Liao, GL; Shi, TL (史铁林*); Tang, ZR; Gao, Y. Molecular dynamic simulations of nanoindentation in aluminum thin film on silicon substrate; Applied Surface Science (IF 2.11). 2010, 256(21) 6284-6290

[27]Dong Wang, Teilin Shi (史铁林*), Jie Pan, Guanglan Liao, Zirong Tang, Lin Liu. Finite element simulation and experimental investigation of forming micro-gear with Zr–Cu–Ni–Al bulk metallic glass Journal of Materials Processing Technology (IF 1.95) 210 (2010) 684–688

[28]Guanglan Liao, Tielin Shi (史铁林*), Xiaohui Lin, Ziwen Ma. Effect of surface characteristic on room-temperature silicon direct bonding. Sensors and Actuators A (IF 1.84) 158 (2010) 335–341

[29]Lei Zhang, Tielin Shi (史铁林*), Shuang Xi, Dan Liu, Zirong Tang, Xiaoping Li, Wuxing Lai. Carbon nanotube integrated 3-dimensional carbon microelectrode array by modified SU-8 photoresist photolithography and pyrolysis. Thin Solid Films (IF 1.60) 520: 1041-1047 (2010)

[30]Ping Peng, Tielin Shi (史铁林*), Guanglan Liao, Zirong Tang. Combined AFM nano-machining and RIE to fabricate high aspect ratio structures, Journal of Nanoscience and Nanotechnology (IF 1.15) 10: 7287-7290 (2010)

[31]Zengbing Xu, Jianping Xuan, Tielin Shi (史铁林*), Bo Wu, Youmin Hu. Application of a modified fuzzy ARTMAP with feature-weight learning for the fault diagnosis of bearing. Expert Systems with Applications (IF 1.85). 36(2009) 9961–9968

[32]Zengbing Xu, Jianping Xuan, Tielin Shi (史铁林*), Bo Wu, Youmin Hu. A novel fault diagnosis method of bearing based on improved fuzzy ARTMAP and modified distance discriminant technique; Expert Systems with Applications (IF 1.85) 36 (2009) 11801–11807

[33]Xiaohui Lin, Guanglan Liao, Zirong Tang, Tielin Shi (史铁林*). UV surface exposure for low temperature hydrophilic silicon direct bonding; Microsyst Technol (IF 0.83) (2009) 15:317–321

Courses Taught

Engineering testing and signal processing

Fault diagnosis

Advanced manufacturing engineering

Centers/Programs

[1]2008.8-2013.8,National 973 Program, The mechanism and implementation of multi physical quantity coordination control in high density flip chip bonding, Principal Investigator of a sub project. 

[2]2008.1-201.12, National Natural Science Foundation of China, The fabrication of 3-D miro-structures with gas sensing function mimicking butterfly wings, Principal Investigator. 

[3]2012.1-2013.12, National Science and Technology Major Project of China, The development of precision mechanical system for process detection equipment, Principal Investigator of a sub project 

[4]2006.1-2008.12,Scientific and Technological Project of Hubei province, Research on needle-free injection system of polypeptdic protein drug and development of needleless injector of insulin, Principal Investigator 

[5]2010.1-2012.12, Grand Project of National Natural Science Foundation of China, A novel method for multi-scale optimal design and manufacturing of biometric hierarchical multilayer microstructures, Principal Investigator 

[6]2012.1-2015.12,National Natural Science Foundation of China, Research on controllable fabrication of 3-D BMG micro/nano-structures based on silicon mould, Principal Investigator 

[7]2009-2011,National Science and Technology Supporting Program of China, Research on the key technology of Chinese high-speed train and the equipment development- research on digital process platform for the high speed train, Principal Investigator 

[8]2010-2011,Digital lift transportation system for intrinsically safe mine, Principal Investigator

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