Professor

Phone: 027-87542604

Email: chimish@163.com chimish@hust.edu.cn

Academic Areas: Electronic packaging and micro/nano fabrication technology, including HP LED packaging, low-temperature bonding and nano packaging

Male, born in Oct. 1970. He received his B. S. and M. S. in Material Engineering from Wuhan University of Science and Technology, and his Ph. D. in Physical Electronics from Huazhong University of Science and Technology. After his doctoral study, he was awarded the postdoctoral fellowship with Professor C. P. Wong at Georgia Institute of Technology, where he conducted studies on nano packaging. Prior in joining Huazhong University of Science and Technology in 2006, he was with Yangtze River Scientific Research Institute, Wuhan as engineer/senior engineer from 1996 to 2002. Currently, his work focused on electronic packaging & micro/nano fabrication. He has published over 40 technical papers and holds over 10 patents.

Academic Degrees

1989.09-1993.07 Wuhan University of Technology, Materials Science and Engineering B. S.

1993.09-1996.06 Wuhan University of Technology, Materials Science and Engineering M. S.

2002.09-2005.12 Huazhong University of Science and Technology, Opto-electronics Ph. D

Professional Experience

1)1996.07-2002.08 Yangtze River Scientific Research Institute, Changjiang Water Resources Committee, Engineer/senior Engineer

2)2010.01-2010.12 Scientific special commissioner in Guangdong Province (part-time )

3)2006.03- Mechanical Science and Engineering at Huazhong University Science and Technology, Associate professor/professor

Selected Publications

[1] M X Chen, et al., Low temperature thermocompression bonding between aligned carbon nanotubes and metalized substrate, Nanotechnology, 2011.8, 22(34): 345704

[2] Liang Yang, Mingxiang Chen, et al., Preparation of a YAG: Ce phosphor glass by screen-printing technology and its application in LED packaging, Optical Letter, 2013.6, 38(13): 2240-2243

[3] Mingxiang Chen, et al., Batch welding of aligned carbon nanotube onto metal electrodes, Microsystem Technology, 2012.06, 18(6): 679-682

[4] Mingxiang Chen, et al., Bonding of carbon nanotubes onto microelectrodes by localized induction heating, Sens. & Actu. A, 2011.11, 170(1-2): 202-206

[5] Wenming Liu, Mingxiang Chen, A novel ceramic packaging technique using selective induction heating, Trans. of the ASME, J. of Elect. Pack., 2009.12, 131: 041010

Courses Taught

1)Fundamentals of function materials For undergraduate at ME

2)Function materials and their applications For graduate at ME

3)Solid-state lighting For undergraduate at MSE

Centers/Programs

1)Preparation and its light emitting mechanism of phosphor glass with gradient refractive index for high power LED packaging (NSFC No: 51372179)

2)Study on low temperature thermocompression bonding using nanoporous metals (NSFC No: 51275194)

3)Study on low temperature wafer bonding based on self propagating exothermic reaction (NSFC No: 50875102 )

4)Development of localized induction heating bonder for MEMS packaging (MST: 2006AA04Z328)

5)Study on the failure mechanism and reliability of LED light sources and lamps (MST: 2011BAE01B14)

6)Research on the direct white LED chip based on wafer bonding (Hubei NSF No: 2011CHB009 )

7)Study on the heat spreader for high power LED packaging (Wuhan No: 201111711563)

8)Study on the packaging technology and materials for high brightness LED packaging (MST: 2011AA03A109)

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