Associate Professor

Phone: 027-87542604


Academic Areas: MEMS chips such as pressure sensor chip, flow sensor chip, vacuum sensor chip, etc.; Vacuum/airtight packaging technology; 3D packaging technology based on TSV

Male, associate professor. Mainly engaged in researches such as MEMS chips, vacuum/airtight packaging technology, 3D packaging technology based on TSV, etc. Successively presided over the projects such as National Natural Science Funds, special MEMS projects in 863 plan, etc. Developed pressure sensor chip, independently developed the vacuum/airtight packaging equipment applied in microelectronic devices.

Academic Degrees

1995.9~1998.7 Huazhong University of Science and Technology Master

1998.9~2001.12 Huazhong University of Science and Technology Doctor

Professional Experience

1.1990.7~1995.8 Hubei Sanonda Co.Ltd

2.2002.1~Today Huazhong University of Science and Technology

Selected Publications

1. Xuefang Wang, Chuan Liu, Zhuo Zhang, Sheng Liu, Xiaobin Luo. A micro-machined Pirani gauge for vacuum measurement of ultra-small sized vacuum packaging. Sensors and Actuators A: Physical. 161(2010) 108–113.

2. Shuai Shi, Xuefang Wang, Chunlin Xu, Jiaojiao Yuan, Jing Fang, Sheng Liu. Simulation and fabrication of two Cu TSV electroplating methods for wafer level 3D integrated circuits packaging. Sensors and Actuators A: Physical. 203(2013) 52–61. (Corresponding author)

3. Shengwei Jiang, Shuai Shi, Xuefang Wang. Nanomechanics and vibration analysis of graphene sheets via a 2D plate model. Journal of Physics D: Applied Physics. 47(2014) 045104. (Corresponding author)

4. Shengwei Jiang, Xionghui Gong, Xing Guo, Xuefang Wang. Potential application of graphene nanomechanical resonator as pressure sensor. Solid State Communications. 193(2014) 30–33. (Corresponding author)

Courses Taught

Undergraduate courses: Microsystem packaging technology foundation

Graduate courses: MEMS packaging technology foundation


Successively presided over the National Natural Science Fund 'ceramics microwave auxiliary plastic cutting technology research' (Number: 50545012), special MEMS projects in 863 plan 'low cost, high performance vacuum welding encapsulation research of key technology and equipment' (Number: 2005AA404260) and 'the long life of MEMS vacuum wafer level packaging technology research' (Number: 2008AA04Z307). Attended the 02 special project 'Key technology research on the three-dimensional system level packaging'.

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