Academic Areas: Intelligent Manufacturing & Robotics, Techniques & Applications for Internet of Things
Bo Tao received his B.S., and Ph.D. degrees in mechanical engineering from Huazhong University of Science and Technology (HUST), in 1999 and 2007, respectively. From June 2007 to June 2009, he was a post-doctor in Department of Electronics Science and Technology, HUST. After that, he has been an associate professor in School of Mechanical Science and Engineering (MSE), HUST from July 2009 to October 2013. From November 2013, he has been a Professor of School of MSE, HUST. He has published more than 40 papers in international journals. His research interests include Intelligent Manufacturing and Robotics, Techniques and Applications of Internet of Things.
2007.6 Mechanical Engineering, Huazhong University of Science and Technology (HUST), China Ph.D
2001.7 Mechanical Engineering, HUST, China M.Sc.
1999.7 Mechanical Engineering, HUST, China B.Sc
November 2013 - present, Professor, School of Mechanical Science and Engineering, HUST, China.
June 2013 – June 2014, Visiting Scholar, University of California, Berkeley, USA
July 2009 – October 2013, Associate Professor, School of Mechanical Science and Engineering, HUST, China.
June 2007 - June 2009: Postdoctoral Fellow, HUST, China.
Bo Tao, Hu Sun, Jixuan Zhu, Zhouping Yin. Design of Anti-Metallic RFID for Applications in Smart Manufacturing, Book Chapter of “Smart Manufacturing Innovation and Transformation: Interconnection and Intelligence”, IGI Press, pp.127-158, 2014
Bo Tao, Han Ding, Zhouping Yin. ACF Curing Process Optimization for Chip-on-Glass (COG) Considering Mechanical and Electrical Properties of Joints. Book Chapter of "New Developments in Liquid Crystals", INTEH Press, pp. 189-206, 2009
Yuanqi Zeng, Bo Tao*, Yin Zhouping. Molecular orientation transformation of pentacene on amorphous SiO2: A computational study on the initial growth stage of physical Vapor deposition, Journal of Crystal Growth, Vol.405, 73-80, 2014
Bo Tao, Guanghua Wu, Yin Zhouping, Youlun Xiong. A Shear Strength Degradation Model for ACA joints under Hygrothermal Conditions, ASME Journal of Electronic Packaging, Vol. 135, 041008-1, 2013.
Guanghua Wu, Bo Tao*, Yin Zhouping. Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions, Microelectronics Reliability, vol.53, 2030–2035, 2013.
Xiancai Chen, Bo Tao*, Zhouping Yin. Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect. ASME Journal of Electronics Packaging, vol.134, 031007-1, 2012.
Bo Tao, Yin Zhouping, Han Ding. ACF Curing Process Optimization Based on Curing Degree Considering Contact Resistance Degradation of Joints. Soldering & Surface Mount Technology, 2010, 22(4): 4-12.
Bo Tao, Yin Zhouping, Han Ding. Reflow Profile Optimization of µBGA Solder Joints Considering Reflow Temperature and Time Coupling. Soldering & Surface Mount Technology, 21/4 (2009) 38-44.
1.Bo Tao, Program for National Top Young Talents in China , Awarded by Organization Department of the Central Committee of the Communist Party of China, 2012
2.Bo Tao, Program for New Century Excellent Talents in University (NCET) , Awarded by Ministry of Education of China, 2010
3.Bo Tao, Nomination Award of National Excellent Ph.D Dissertation of China, 2009.
4.Zhouping Yin, Yuhui Wang, Youlun Xiong, Bo Tao, et al. Key Equipment for High Performance Radio Frequency Identification (RFID) Tag Manufacturing. Second-Class Prize of National Technology Invention Prize of China, 2013.
5.Zhouping Yin, Yuhui Wang, Youlun Xiong, Bo Tao, et al. High Performance Radio Frequency Identification (RFID) Inlay Manufacturing Equipment and Technology. First-Class Prize for Technology Invention Prize, Awarded by Hubei Province of China, 2011.
6.Han Ding, Bo Tao, et al. Telemonitoring Technologies Based on Embedded Networking, Second-Class Prize for Progress in Science and Technology, Awarded by Shanghai Municipality of China, 2005.
 “Fundaments of Flexible Electronic Manufacturing Technology” for Undergraduates
 “Introduction for Flexible Manufacturing & Automation” for Undergraduates
1．Online Sensing and Reconstruction of Cutting Force, Heat and Shape distortion during Machining Process. Fund from the National Key Fundamental Research Program of China (973)
2．Fields-induced Deposition Manufacturing of Nano Film Structure and its Performance Control for Flexible Electronics. Nano-Manufacturing Special Fund from National Natural Science Foundation of China (NSFC)
3．Multi-physics Modeling, Analysis and Control for Anisotropic Conductive Film Bonding of Chips with Ultra-fine Bumps. Fund from National Natural Science Foundation of China (NSFC)
4．Digital Manufacturing Techniques for High Performance Electric Power Equipment’s’ Workshop. Fund from the National Key Scientific and Technological Research Program
5．Research and Application of Digital Workshop Platform for Large-size and High Precision Products Manufacturing. Fund from the National Key Scientific and Technological Research Program