Selected Publications
[1] Zhang L, Zhao H, S Liang S, Liu C *， “Heat transfer in phase change materials for integrated batteries and power electronics systems”, Applied Thermal Engineering, 232, September 2023, pp.120997-120997, ISSN: 1359-4311. https://doi.org/10.1016/j.applthermaleng.2023.120997
[2] Chen Y, Liu C, Zhou Z, Liu C*, “Transient liquid phase bonding with Ga-based alloys for electronics interconnections”, Journal of Manufacturing Processes, Volume 84, December 2022, Pages 1310-1319, https://doi.org/10.1016/j.jmapro.2022.11.005
[3] Liu C, Liu A, Jiang H, Liang S, Zhou Z, Liu C*, “Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging”, Microelectronics reliability, Volume 138, November 2022, 114688, https://doi.org/10.1016/j.microrel.2022.114688
[4] Jiang H, Robertson S, Liang S, Zhou Z, Zhao L, Liu C*, “Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite”, Materials Today Communications, Volume 33, December 2022, 104623, https://doi.org/10.1016/j.mtcomm.2022.104623
[5] Ramachandran S, Zhong Y, Robertson S, Panteli C, Liang S, Wu F, Zhou R, Marathe S, Zhou Z, Holmes AS, Haigh SJ*, Liu C*, Wajira Mirihanage*, “Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding”, Materialia, Volume 23, June 2022, 101444. https://doi.org/10.1016/j.mtla.2022.101444
[6] Liu C, Liu A, Su Y, Chen Y, Zhou Z, Liu C*, “Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects”, Journal of Manufacturing Processes, Volume 73:139-148, January 2022. https://doi.org/10.1016/j.jmapro.2021.10.065
[7] Su Y, Fu G, Liu C*, Zhang K, Zhao L, Liu C, Liu A, Song J, “Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores”, Computer Methods in Applied Mechanics and Engineering 378: 113729, 01 Mar 2021. https://doi.org/10.1016/j.cma.2021.113729
[8] Zhu W, Wang X, Liu C*, Zhou Z, Wu F, “Formation and homogenisation of SnCu interconnects by self-propagated exothermic reactive bonding”, Materials & Design, 174:107781, 06 April 2019. https://doi.org/10.1016/j.matdes.2019.107781
[9] R. Rebelo AM, Liu Y, Liu C*, Schäfer K-H, Saumer M, Yang G, “Carbon Nanotube-Reinforced Poly(4-vinylaniline)/Polyaniline Bilayer-Grafted Bacterial Cellulose for Bioelectronic Applications”, ACS Biomaterials Science & Engineering 5(5):2160-2172, 13 May 2019, https://doi.org/10.1021/acsbiomaterials.9b00039
[10] Rebelo A, Liu Y, Liu C*, Schäfer KH, Saumer M, Yang G. “Poly(4-vinylaniline)/polyaniline bilayer functionalized bacterial cellulose membranes as bioelectronics interfaces”, Carbohydrate Polymers 204:190-201, 15 Jan 2019, https://doi.org/10.1016/j.carbpol.2018.10.017
[11] Liu, L., Chen, Z., Zhou, Z., Chen, G., Wu, F., Liu, C*. “Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects”, Journal of Alloys and Compounds, Volume 722:746-752, 25 Oct 2017.
[12] Chen, Z., Zhang, X*., Chen, P., Li, W., Zhou, K., Shi, L., Liu, K., Liu, C*. “3D multi-nozzle system with dual drives highly potential for 3D complex scaffolds with multibiomaterials”, International Journal of Precision Engineering and Manufacturing, 18:755-761, 09 May 2017.
[13] Chen, Z., Zhang, X*., Yang, Y., Zhou, K., Wragg, N., Liu, Y., Lewis, M., Liu, C*. “Fabrication and characterization of 3D complex hydroxyapatite scaffolds with hierarchical porosity of different features for optimal bioactive performance”, Ceramics International, Part A, Volume 43: 336–344, January 2017.
[14] Gao, X., Shi, Z., Kuśmierczyk, P., Liu, C., Yang, G., Sevostianov, I., Silberschmidt, VV*. “Time-dependent rheological behaviour of bacterial cellulose hydrogel”, Materials Science and Engineering: C, Volume 58: 153–159, 1 January 2016.
[15] Zhao, W., Shi, Z., Chen, X., Yang, G., Lenardi, C., Liu, C*. “Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compression”, Composites Part B: Engineering, Volume 76, July 2015, Pages 292–299.
[16] Lim, YY*., Goh, YM., Liu, C*., Hutt, DA. “Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces”, Surface and Coatings Technology, Volume 266, 25 March 2015, Pages 93-104.
[17] Tian,Y*., Liu, C*., Hutt, DA ,Stevens,B, “Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection”, Journal of Electronic Materials, 43(2), 01st February 2014, 594-603.
[18] Zhao, W., Liu, C*., Wu, F., Lenardi, C*. “An investigation on the mechanical behaviour of poly(2-hydroxyethyl methacrylate) hydrogel membrane under compression in the assembly process of microfluidic system”, Journal of Polymer Science Part B: Polymer Physics, 52, 2014, pp.485-495.
[19] Xiong, Z., Dong, C., Cai, H., Liu, C*., Zhang, X., “Composite inks of poly(3,4-ethylenedioxythiophene)/poly(styrenesulfonate)/silver nanoparticles and electric/optical properties of inkjet-printed thin films”, Materials Chemistry and Physics, 141, 2013, pp416-422.
[20] Lim, Y*., Goh, YM., Liu, C*. “Surface Treatments for Inkjet Printing onto a PTFE-based Substrate for High Frequency Applications", Industrial & Engineering Chemistry Research, 52, 2013, pp11564−11574.
[21] Zhang, Y., Liu, C*., Whalley, DC., “The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers”, Appl. Phys. Lett. 102, 2013, pp103303.
[22] Xiong, Z., Liu, C*. “Optimisation of inkjet printed PEDOT:PSS thin films through annealing processes”, Organic Electronics, Volume 13, Issue 9, September 2012, Pages 1532–1540.
[23] Williams, O*., Webb, DP., Liu, C*., Firth, P. “Evaluation of contamination of ceramic surfaces and its effect on epoxy bleed.” International Journal of Adhesion & Adhesives, 32 (2012)61–69.
[24] Cheng, X*., Liu, C*. & Silberschmidt, V.V. "Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures", Computational Materials Science, vol. 52, Issue 1, 2011, pp. 274-281.
[25] Xu, H*., Liu, C*., Silberschmidt, V.V., Pramana, S.S., White, T.J., Chen, Z., Acoff, V.L. “ Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds.” Acta Materialia, 59 (2011) 5661–5673.
[26] Xu, H*., Liu, C*., Silberschmidt, V.V., Pramana, S.S., White, T.J., Chen, Z., Acoff, V.L. “New mechanisms of void growth in Au–Al wire bonds: Volumetric shrinkage and intermetallic oxidation.” Scripta Materialia, 65, 2011, pp 642-645.
[27] Qin, Y., Wilcox, G.D*., Liu, C. “Electrodeposition and characterisation of Sn–Ag–Cu solder alloys for flip-chip interconnection.” Electrochimica Acta. 56 (2010) 183–192.
[28] Ebbens, S., Hutt, D.A., and Liu, C*. “The Thermal Stability of Alkanethiol Self-Assembled Monolayers on Copper for Fluxless Soldering Applications”, IEEE Transactions on Components and Packaging Technologies, 33(2), June 2010, pp251-259.
[29] Hin, T.Y., Liu, C*., Conway,P.P., Yu, W., Cargill, S., Desmulliez,M.P.Y. “Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithography”, IEEE Photonics Technology Letters, 22(13), July 2010, pp 957-959.
[30] Williams, O*., Liu, C*., Webb, D.P. and Firth, P. ''Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies'', International Journal of Adhesion and Adhesives, 30(4), June 2010, pp 225-235.
[31] Knauf, B.J*., Webb, D.P., Liu, C*. and Conway, P.P., ''Low frequency induction heating for the sealing of plastic microfluidic systems'', Microfluidics and Nanofluidics, November 2009, 243-252.
[32] Gong, J*., Liu, C*., Conway, P.P. and Silberschmidt, V. ‘’Initial formation of Cu-Sn intermetallic compounds between molten Sn-Ag-Cu solder and Cu substrate’’, Scripta Materialia, 60, 2009, pp 333-335.
[33] ebb, D.P*., Knauf, B., Liu, C., Hutt, D.A., Conway, P.P., “Productionisation issues for commercialisation of microfluidic based devices”, Sensor Review, 29(4) 2009: 349-354.
[34] ong, J*., Liu, C*., Conway, P.P. and Silberschmidt, V. ''Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate'', Acta Materiala, Volume 56, Issue 16, 4291-4297, June 2008.
[35] hen, K*., Liu, C*., Whalley, D.C., Hutt, D.A., Li, J.F., Mannan, S.H. “A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin” Acta Materialia 56 (2008) 5668–5676. (8).
[36] Hutt, D.A*. and Liu, C. ''Oxidation Protection of Copper Surfaces using Self-assembled Monolayers of Octadecanethiol'', Applied Surface Science, 2522, 15th October 2005, 400-411.
