Liu Changqing




Academic Areas: Heterogenous integration and packaging of semiconductors; Advanced interconnect materials (AIMs) and manufacturing for Wide Band-gap (WBG) devices; Hybrid multi-material and multi-functional embodiment of bioelectronics and smart wearable electronics.


Professor Liu received his PhD degree from the University of Hull, United Kingdom (UK) in 1998. He worked as a postdoctoral researcher from 1997 to 2000 at the University of Birmingham, UK. From 2000 he served Loughborough University (UK) as a postdoctoral researcher, lecturer, senior lecturer and became Professor of Electronics Manufacture from 2011. Since October 2023, he has taken up professorship and doctoral supervisor at Huazhong University of Science and Technology, China.

Prof Liu’s research takes place at the interface between advanced materials and manufacturing. For decades, Prof Liu has been actively leading and participating in innovative cutting-edge research primarily centred around high value manufacturing with advanced electronic materials and technologies. His latest research strands and foci include: i) Advanced Interconnect Materials (AIMs) for wide band-gap (WBG) semiconductor devices for high temperature and power electronics; ii) Hybrid manufacturing and innovation to enable multi-material, multi-component and multi-function integration of bioelectronics and smart wearable electronics for medical and healthcare applications.

Prof Liu has published over 300 academic papers in the international journals associated with materials and advanced manufacturing, such as Materials & Design, Acta Materialia, Carbohydrate Polymers. He was one of principal investigators (PI) at the national Power Electronics Centre and the Innovation Electronics Manufacturing Centre in the UK, and the initiator and leader of the EU Micro- Multi-Material Manufacture to Enable Multifunctional Miniaturised Devices (M6) project. Prof Liu was the Instigator and General Chair of the International Conference in Advanced Manufacturing for Multi-functional Miniaturised Devices – ICAM3D (2010-15), organised through the local committees in China, Germany, Japan, and UK. He collaborates extensively with ~30 universities or research institutions around the world, including Imperial College, King's College London, University of Nottingham, University of Manchester, Nanyang Technological University in Singapore, City University of Hong Kong, and supervised ~40 doctoral students. He is a Fellow of Higher Education Academy, a senior member of Engineering Professors Council in the UK, a senior member of the Institute of Electrical and Electronics Engineers (IEEE) USA, and a former Chairman of the Interconnection Committee of the Electronics Components and Technology Conference (ECTC) - a flagship event of IEEE Electronic Packaging Society (EPS). He has been honoured as a Guest Professor at Nanyang Technological University in Singapore, Huazhong University of Science and Technology, Harbin Institute of Technology, and City University of Hong Kong (sponsored and appointed by the Royal Society UK) in China.


Academic Degrees


09/1981-07/1985, Nanjing University of Science and Technology, Nanjing, China. BEng

09/1985-07/1988, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China. MSc

12/1993-07/1998, The University of Hull, Hull, UK. PhD



Professional Experience

10/2023-present, Professor, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, China.

01/2011-09/2023, Professor of Electronics Manufacture, Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, UK.

02/2000-12/2010, Research Fellow (02/2000), Lecturer (10/2005), Senior Lecturer (05/2007), Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, UK.

02/1997-01/2000, Research Fellow, Interdisciplinary Research Centre (IRC) in Materials for High Performance Applications, The University of Birmingham, UK.

09/1988-12/1993, Assistant Professor, Institute of Metal Research, Chinese Academy of Sciences, China.


Selected Publications

[1] Zhang L, Zhao H, S Liang S, Liu C *, “Heat transfer in phase change materials for integrated batteries and power electronics systems”, Applied Thermal Engineering, 232, September 2023, pp.120997-120997, ISSN: 1359-4311.

[2] Chen Y, Liu C, Zhou Z, Liu C*, “Transient liquid phase bonding with Ga-based alloys for electronics interconnections”, Journal of Manufacturing Processes, Volume 84, December 2022, Pages 1310-1319,

[3] Liu C, Liu A, Jiang H, Liang S, Zhou Z, Liu C*, “Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging”, Microelectronics reliability,  Volume 138, November 2022, 114688,

[4] Jiang H, Robertson S, Liang S, Zhou Z, Zhao L, Liu C*,  “Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite”, Materials Today Communications, Volume 33, December 2022, 104623,

[5] Ramachandran S, Zhong Y, Robertson S, Panteli C, Liang S, Wu F, Zhou R, Marathe S, Zhou Z, Holmes AS, Haigh SJ*, Liu C*, Wajira Mirihanage*, “Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding”, Materialia, Volume 23, June 2022, 101444.

[6] Liu C, Liu A, Su Y, Chen Y, Zhou Z, Liu C*, “Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects”, Journal of Manufacturing Processes, Volume 73:139-148, January 2022.

[7] Su Y, Fu G, Liu C*, Zhang K, Zhao L, Liu C, Liu A, Song J, “Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores”, Computer Methods in Applied Mechanics and Engineering 378: 113729, 01 Mar 2021.

[8] Zhu W, Wang X, Liu C*, Zhou Z, Wu F, “Formation and homogenisation of SnCu interconnects by self-propagated exothermic reactive bonding”,  Materials & Design, 174:107781,  06 April 2019.

[9] R. Rebelo AM, Liu Y, Liu C*, Schäfer K-H, Saumer M, Yang G, “Carbon Nanotube-Reinforced Poly(4-vinylaniline)/Polyaniline Bilayer-Grafted Bacterial Cellulose for Bioelectronic Applications”,  ACS Biomaterials Science & Engineering 5(5):2160-2172, 13 May 2019,

[10] Rebelo A, Liu Y, Liu C*, Schäfer KH, Saumer M, Yang G. “Poly(4-vinylaniline)/polyaniline bilayer functionalized bacterial cellulose membranes as bioelectronics interfaces”, Carbohydrate Polymers 204:190-201, 15 Jan 2019,

[11] Liu, L., Chen, Z., Zhou, Z., Chen, G., Wu, F., Liu, C*. “Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects”, Journal of Alloys and Compounds, Volume 722:746-752, 25 Oct 2017.

[12] Chen, Z., Zhang, X*., Chen, P., Li, W., Zhou, K., Shi, L., Liu, K., Liu, C*. “3D multi-nozzle system with dual drives highly potential for 3D complex scaffolds with multibiomaterials”,  International Journal of Precision Engineering and Manufacturing, 18:755-761, 09 May 2017.

[13] Chen, Z., Zhang, X*., Yang, Y., Zhou, K., Wragg, N., Liu, Y., Lewis, M., Liu, C*. “Fabrication and characterization of 3D complex hydroxyapatite scaffolds with hierarchical porosity of different features for optimal bioactive performance”, Ceramics International, Part A, Volume 43: 336–344, January 2017.

[14] Gao, X., Shi, Z., Kuśmierczyk, P., Liu, C., Yang, G., Sevostianov, I., Silberschmidt, VV*. “Time-dependent rheological behaviour of bacterial cellulose hydrogel”, Materials Science and Engineering: C, Volume 58: 153–159, 1 January 2016.

[15] Zhao, W., Shi, Z., Chen, X., Yang, G., Lenardi, C., Liu, C*.  “Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compression”,  Composites Part B: Engineering, Volume 76, July 2015, Pages 292–299.

[16] Lim, YY*., Goh, YM., Liu, C*., Hutt, DA. “Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces”, Surface and Coatings Technology, Volume 266, 25 March 2015, Pages 93-104.

[17] Tian,Y*., Liu, C*., Hutt, DA ,Stevens,B, “Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection”, Journal of Electronic Materials, 43(2), 01st February 2014, 594-603.

[18] Zhao, W., Liu,  C*., Wu, F., Lenardi, C*. “An investigation on the mechanical behaviour of poly(2-hydroxyethyl methacrylate) hydrogel membrane under compression in the assembly process of microfluidic system”,  Journal of Polymer Science Part B: Polymer Physics, 52, 2014, pp.485-495.

[19] Xiong, Z., Dong, C., Cai, H., Liu, C*., Zhang, X.,  “Composite inks of poly(3,4-ethylenedioxythiophene)/poly(styrenesulfonate)/silver nanoparticles and electric/optical properties of inkjet-printed thin films”,  Materials Chemistry and Physics, 141, 2013, pp416-422.

[20] Lim, Y*., Goh, YM., Liu, C*. “Surface Treatments for Inkjet Printing onto a PTFE-based Substrate for High Frequency Applications", Industrial & Engineering Chemistry Research, 52, 2013, pp11564−11574.

[21] Zhang, Y., Liu, C*., Whalley, DC., “The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers”, Appl. Phys. Lett. 102, 2013, pp103303.

[22] Xiong, Z., Liu, C*. “Optimisation of inkjet printed PEDOT:PSS thin films through annealing processes”, Organic Electronics,  Volume 13, Issue 9, September 2012, Pages 1532–1540.

[23] Williams, O*., Webb, DP., Liu, C*., Firth, P. “Evaluation of contamination of ceramic surfaces and its effect on epoxy bleed.” International Journal of Adhesion & Adhesives, 32 (2012)61–69.

[24] Cheng, X*., Liu, C*. & Silberschmidt, V.V. "Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures", Computational Materials Science, vol. 52, Issue 1, 2011, pp. 274-281.

[25] Xu, H*., Liu, C*., Silberschmidt, V.V., Pramana, S.S., White, T.J.,  Chen, Z., Acoff,  V.L. “ Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds.” Acta Materialia, 59 (2011) 5661–5673.

[26] Xu, H*., Liu, C*., Silberschmidt, V.V., Pramana, S.S., White, T.J.,  Chen, Z., Acoff,  V.L. “New mechanisms of void growth in Au–Al wire bonds: Volumetric shrinkage and intermetallic oxidation.” Scripta Materialia, 65, 2011, pp 642-645.

[27] Qin, Y., Wilcox, G.D*., Liu,  C.  “Electrodeposition and characterisation of Sn–Ag–Cu solder alloys for flip-chip interconnection.”  Electrochimica Acta. 56 (2010) 183–192.

[28] Ebbens, S., Hutt, D.A., and Liu, C*. “The Thermal Stability of Alkanethiol Self-Assembled Monolayers on Copper for Fluxless Soldering Applications”, IEEE Transactions on Components and Packaging Technologies, 33(2), June 2010, pp251-259.

[29] Hin, T.Y., Liu, C*., Conway,P.P., Yu, W., Cargill, S., Desmulliez,M.P.Y. “Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithography”, IEEE Photonics Technology Letters, 22(13), July 2010, pp 957-959.

[30] Williams, O*., Liu, C*., Webb, D.P. and Firth, P. ''Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies'', International Journal of Adhesion and Adhesives, 30(4), June 2010, pp 225-235.

[31] Knauf, B.J*., Webb, D.P., Liu, C*. and Conway, P.P., ''Low frequency induction heating for the sealing of plastic microfluidic systems'', Microfluidics and Nanofluidics, November 2009, 243-252.

[32] Gong, J*., Liu, C*., Conway, P.P. and Silberschmidt, V. ‘’Initial formation of Cu-Sn intermetallic compounds between molten Sn-Ag-Cu solder and Cu substrate’’, Scripta Materialia, 60, 2009, pp 333-335.

[33] ebb, D.P*., Knauf, B., Liu, C., Hutt, D.A., Conway, P.P.,  “Productionisation issues for commercialisation of microfluidic based devices”, Sensor Review, 29(4) 2009: 349-354.

[34] ong, J*., Liu, C*., Conway, P.P. and Silberschmidt, V. ''Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate'', Acta Materiala, Volume 56, Issue 16, 4291-4297, June 2008.

[35] hen, K*., Liu, C*.,  Whalley, D.C., Hutt, D.A., Li, J.F., Mannan, S.H. “A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin” Acta Materialia 56 (2008) 5668–5676. (8).

[36] Hutt, D.A*. and Liu, C. ''Oxidation Protection of Copper Surfaces using Self-assembled Monolayers of Octadecanethiol'', Applied Surface Science, 2522, 15th October 2005, 400-411.



Awards and Honors

2015: Chair of ‘Interconnections’ committee of ECTC - IEEE EPS flagship conference, USA.

2012: Royal Society Kan Tong Po Visiting Professor of City University of Hong Kong, China.

2011: Guest Professor of Huazhong University of Science and Technology, China.

2010: Two student travel grant awards of ECTC attendance, Las Vegas, USA.

2009: Best Student Paper Award at ICEPT Tsinghua University, Beijing, China.

2007: Visiting Professor of Nanyang Technical University, Singapore.

2005: Visiting Professor of Harbin Institute of Technology, China.

2003: The Best Paper Award at the 28th IEMT (SEMI, IEEE/CPMT), San Jose, USA.

2003: Cookson Electronics Paper Award at 5th EMAP (IEEE/CPMT), Singapore.

1993: Overseas Research Students (ORS) Awards, CVCP, UK.



Courses Taught