Huang Yongan





Academic Areas: Advanced Mechanics of Materials and Structures Flexible Multibody Dynamics

Yongan Huang is an assoicate professor, who obtained BA and BS degrees in Civil Engineering from the Northwestern Polytechnical University, China, in 1997.  From the Northwestern Polytechnical University, he received SM degrees in Structural Engineering in 2004 and the PhD degree in Mechanics in 2007.  From 2007 to 2009, he was a postdoctor in Huazhong University of Science and Technology. He joined Huazhong University of Science and Technology as assoicate professor in 2009, serving at the Engineering State Key Lab of Digital Manufacturing Equipment & Technology. And he reasearched at the Northwestern University during 2012 as Visiting scholar. He was awarded the China National Funds for Excellent Young Scientists Award in 2013, and New Century Talent Supporting Project by education ministry in 2011.

He has published over 30 SCI papers on journals such as Nature Communications, Small, Scientific Reports, Nanoscale, Lab on a Chip, Soft matter, IEEE Trans., ASME Trans., Journal of Applied Physics, Thin solid film, and so on. Meanwhile, he also published two monographs and was invited to publish one Chapter of an English monograph and one conference proceedings. Up to now, more than 10 patents for invention had been authorized. He also received the national natural science fund for outstanding youth fund and the ministry of education program for new century excellent talents at 2013, national natural science foundation of China mechanical discipline excellent finished project award at 2011.

He is the Managing director of the artificial intelligence association of Hubei Province, one of peer-reviewed experts in the National Natural Science Foundation, the editorial board member of Journal of Nanoscience Letters, and the ASME and IEEE member. He is also the reviewer of many important journals such as Nanoscale, Small, Soft Matter, APL, IEEE Trans, ASME Trans and China Science.

Academic Degrees

1997.09-2001.06 Northwestern Polytechnical University B.S. Civil Engineering

2001.09-2004.04 Northwestern Polytechnical University M.S. Structural Engineering

2004.04-2007.04 Northwestern Polytechnical University Ph.D. Mechanics

Professional Experience

Postdoctor, Huazhong University of Science and Technology, China (4/2007 – 4/2009)

Lecturer, Huazhong University of Science and Technology, China (3/2009 – 11/2009)

Assoicate Professor, Huazhong University of Science and Technology, China (11/2009 - present)

Visiting scholar, Northwestern University, USA(01/2012-12/2012)

Selected Publications

1.YA Huang*, NB Bu, YQ Duan, YQ Pan, H Liu, ZP Yin, YL Xiong, Electrohydrodynamic direct-writing. Nanoscale, 2013, 5: 12007-12017

2.Yongqing Duan, Yongan Huang*, Zhouping Yin, Ningbin Bu, Wentao Dong, Non-wrinkled, highly stretchable piezoelectric devices by electrohydrodynamic direct-writing. Nanoscale, 2014, 6: 3289-3295

3.Y Su, S Wang, YA Huang, H Luan, W Dong, JA Fan, Q Yang, JA Rogers, Elasticity of Fractal Inspired Interconnects. Small, 2014

4.YA Huang, Y Wang, L Xiao, H Liu, W Dong, Z Yin, Microfluidic serpentine antennas with designed mechanical tenability. Lab on a Chip, 2014, 14 (21): 4205-4212

5.YA Huang, Y Duan, Y Ding, N Bu, Y Pan, N Lu, Z Yin, Versatile, kinetically controlled, high precision electrohydrodynamic writing of micro/nanofibers. Scientific Reports, 2014, 4, 5949

6.Yongan Huang*, Xiaomei Wang, Yongqing Duan, Ningbin Bu, Zhouping Yin*, Controllable self-organization of colloid microarrays based on finite length effects of electrospun ribbons, Soft Matter, 2012, 8: 8302-8311

7.Z Liu, PS Valvo, YA Huang*, ZP Yin, Cohesive failure analysis of an array of IC chips bonded to a stretched substrate. International Journal of Solids and Structures, 2013, 50(22): 3528-3538

8.B Peng, YA Huang*, ZP Yin, YL Xiong, Analysis of interfacial peeling in IC chip pick-up process. Journal of Applied Physics, 2011, 110, 073508

9.YQ Duan, YA Huang*, ZP Yin, Transfer printing and patterning of stretchable electrospun film. Thin Solid Films, 2013, 544: 152–156

10.YA Huang*, ZP Yin, YL Xiong, Thermomechanical analysis of thin films on temperature-dependent elastomeric substrates in flexible heterogeneous electronics. Thin Solid Films, 2010, 518 (6): 1698-1702

11.X Hu, Y Huang, Z Yin, Y Xiong, Optimization-based model of tunneling-induced distributed loads acting on the shield periphery. Automation in Construction, 2012, 24: 138-148

12.Z Liu, YA Huang, H Liu, J Chen, Z Yin, Reliable Peeling of Ultrathin Die With Multineedle Ejector. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(9): 1545-1554

13.YongAn Huang*, ZhouPing Yin, Jiankui Chen, YouLun Xiong, Roll-to-Roll Processing of Flexible Heterogeneous Electronics with Low Interfacial Residual Stress. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011, 1(9): 1368-1377

14.Z Liu, Y Huang, J Chen, Z Yin, Tunable Peeling Technique and Mechanism of Thin Chip from Compliant Adhesive Tapes. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(4): 560-568

15.NB Bu, YA Huang*, YQ Duan, ZP Yin, Process Optimization of Mechano-Electrospinning by Response Surface Methodology. Journal of Nanoscience and Nanotechnology, 2014, 14(5): 3464-3472.

16.Canan Dagdeviren, Yewang Su, Pauline Joe, Raissa Yona, Yuhao Liu, Yun-Soung Kim, YongAn Huang, Anoop R Damadoran, Jing Xia, Lane W Martin, Yonggang Huang, John A Rogers, Conformable amplified lead zirconate titanate sensors with enhanced piezoelectric response for cutaneous pressure monitoring. Nature communications, 2014, 5, 4496

17.ZP Yin*, YA Huang*, NB Bu, XM Wang, YL Xiong, Inkjet printing for flexible electronics: Materials, processes and equipments. Chinese Science Bulletin, 2010, 55 (30), 3383-3407

18.NB Bu, YA Huang*, XM Wang, ZP Yin, Continuously Tunable and Oriented Nanofiber Direct-Written by Mechano-Electrospinning. Materials and Manufacturing Processes, 2012, 27 (12), 1318-1323

19.YQ Pan, YA Huang*, NB Bu, ZP Yin, Fabrication of Si-nozzles for parallel mechano-electrospinning direct writing. Journal of Physics D: Applied Physics, 2013, 46 (25), 255301

20.NB Bu, YA Huang*, H Deng, ZP Yin, Tunable bead-on-string microstructures fabricated by mechano-electrospinning. Journal of Physics D: Applied Physics, 2012, 45 (40), 405301

21.YA Huang*, ZP Yin, YL Xiong, Thermomechanical analysis of film-on-substrate system with temperature-dependent properties. Journal of Applied Mechanics, 2010, 77, 041016

22.B Peng, Y Huang, Z Yin, Y Xiong, Competing Fracture Modeling of Thin Chip Pick-Up Process. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(7): 1217-1225

23.XT Hu, YA Huang, ZP Yin, YL Xiong, Driving force planning in shield tunneling based on Markov decision processes. Science China Technological Sciences, 2012, 55 (4): 1022-1030

24.Z Liu, YA Huang, Z Yin, S Bennati, PS Valvo, A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints. International Journal of Adhesion and Adhesives, 2014, 54: 112-123

Awards and Honors

2013 The National Excellent Youth Fund Project

2011 The new century excellent talents of ministry of education program

2014 Scientific innovation talents of Hubei province

2014 The gold award of Swiss Geneva international invention exhibition

2011 National natural science foundation of China mechanical discipline excellent finished project award

Courses Taught

Undergraduate courses: 1. The robot technology 2. Flexible electronics manufacturing technology

Graduate courses: 1. Robotics 2. Flexible Electronics Devices and Manufacturing



1.Excellent Youth Fund Project of NSFC “Flexible Electronics Manufacturing Technology and Application”

2.Genergal Fund Project of NSFC “Electrohydrodynamic Printing for Flexible Micro/Nano-structures”

3.Youth Fund Project of NSFC

4.Sub-Project of Major research plan of NSFC

5.The key national projects


1.Two key projects of NSFC