Assistant Professor Ye Chang from the University of Akron and Assistant Professor Lin Dong from Kansas State University Visited MSE
Author: Edit:       Release time:Oct 6, 2017       click:

At the invitation of Prof. Chen Mingxiang and Prof. Zhu Fulong, Assistant Professor Ye Chang from University of Akron and Assistant Professor Lin Dong from Kansas State University visited MSE on May 18, 2017. They delivered academic reports succesively in Room A416 of the Advanced Manufacturing Building, which attracted lots of teachers and students to attend.

In the morning, Dr. Ye Chang delivered an academic report with the topic of “Effect of Ultrasonic Nanocrystal Surface Modification on Mechanical Properties of Metallic Components”. In this report, the principle and application in 3D printing of ultrasonic nanocrystal surface modification (UNSM) were introduced minutely. He also illustrated the effects of UNSM on the microstructure of metal components, surface topography and residual stress status and how they affect the fatigue behavior, abrasion performance and corrosion resistance performance of metal components.  

Then, Dr. Lin Dong delivered two academic reports. The first report named “Improving Fatigue Performance of Additive Manufactured Metal Structures by Ultra-Stable Microstructures”, which explained how high density dislocation and nanostructure were introduced to laser shock peening to improve the fatigue behavior of metal components. The second report named “3D Freeze Assembling Printing of Graphene Aerogel”, which introduced the principle of 3D printing based on freezing. He contrived the lightest three-dimensional bulk material of the world, graphene aerogels, which has been certified by the Guinness Book of World Records.

Dr. Ye Chang and Dr. Lin Dong also visited the 3D Printing Laboratory of MSE and the Flexible Electronic Center of HUST. They made in-depth exchanges with Prof. Xu Jianfeng, Prof. Zhang Honghai and Prof. Wu Zhigang on intelligent manufacturing, 3D printing, and the research and development of flexible electronic device.

 

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Visiting campus

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