From May 29 to June 5, Prof. Tielin Shi, Guanglan Liao, and Miss. Li Du attended the 66th Electronic Components and Technology Conference (ECTC, 2016), which was held at the Cosmopolitan of Las Vegas, Nevada, USA. They gave an oral presentation on “Low Temperature Cu nanorod/Sn/Cu nanorod Bonding Technology for 3D Integration” under session 20: Flip chip: Bonding, Materials and Reliability. In this presentation, they proposed a novel method of using Cu nanorods for the application of low temperature Cu/Sn bonding.
The theme of the conference is electronic packaging technology, covering the following topics: (1) advanced packaging technology, including the TSV technology, embedded technology, flip chip, wafer level packaging, MEMS and sensors, the system level encapsulation, heterogeneous integration, etc., (2) the application of reliability problems, including the TSV/3D integration, challenge system level reliability, flip chip/wire interconnection reliability, LED/RFID/IOT reliability, reliability testing method, etc., (3) assembly and manufacturing techniques, including thermal bonding, warp control problem, etc., (4) emerging technologies, including wireless packaging components, 3D printing, new additive materials and methods, flexible, nano integration and battery materials, (5) high wireless components and interconnection technology, including the design of interconnection structure performance, thermal/mechanical/electrical testing and reliability issues, 3D integration, TSV, carbon nanotubes, graphene, wire bonding, optical interconnection, and many other topics.
During the conference, Prof. Tielin Shi, Guanglan Liao had a broad and in-depth exchange of views on their latest research with Prof. Jing Chen (Peking Univ.), Jian Cai (Tsinghua Univ.), Dr. Kyung-Wook Paik (KAIST), Chuantong Chen (Osaka University), and Dr. Zhitao Cao (Sandisk Cor.). They also discussed potential cooperation in the future.
This communication was financially supported by the international cooperation promotion project of School of Mechanical Science and Engineering.
