Prof. Chen Mingxiang of MSE and his team achieved new progress in advanced electronic packaging, with their research findings titled “Active Thermal Management of High-Power LED Through Chip on Thermoelectric Cooler” published on IEEE Transactions on Electron Devices, an authoritative journal in the international field of microelectronic devices. Recently, this was reported by a column in Semiconductor Today, a famous magazine in international semi-conductor industry. The research was carried out by Prof. Chen Mingxiang’s team (hereafter “the team”) and Associate Prof. Xu Jian’s team of Wuhan Polytechnic University, with HUST as the first unit of the paper. MSE master student Li Shuang was first author of the paper, and Prof. Chen Mingxiang and Dr. Peng Yang were corresponding authors.
Light-emitting diode (LED), taking the place of traditional light sources such as incandescent and fluorescent lamps, are widely used in various fields such as indoor illumination, display backlighting, car headlights, and special illumination. The light and heat generated by LED chips are transmitted or conducted through a variety of packaging materials and interfaces. Part of the light is converted into heat during the propagation process, and the accumulation of heat causes the degradation of light output simultaneously. In addition, the accumulated heat negatively influences the reliability and lifetime of LED. Thus, the heat dissipating problem is one of the technical choke points to the development of high-power LED.
In this work, the team proposed a chip on thermoelectric cooler (chip-on-TEC) for the active thermal management of high-power LED. The chip-on-TEC was prepared by electroplating a circuit layer on the cold-side substrate of thermoelectric cooling (TEC) and directly attaching LED chips on the circuit layer. Due to the Peltier effect of TE materials and the low thermal resistance of chip-on-TEC structure, the heat generated from the chips can be dissipated to the surrounding environment effectively. The performances of chip-on-TEC were studied by using the thermal simulation and packaging experiment. Compared with the traditional packaging structure, the working temperature of chip-on-TEC is greatly reduced under various chip currents. Moreover, the light output power of LED is increased by 35%. The results demonstrate that the chip-on-TEC is a promising thermal management technology that can be wildly used in high-power devices (including the third generation of semiconductor devices) and high-temperature devices packaging. The research is financially supported by National Natural Science Foundation of China and National Key Research and Development Plan.
It is known that IEEE Transactions on Electron Devices is an authoritative journal in the international field of microelectronic devices, enjoying a high reputation in this field. Semiconductor Today is a famous independent and non-profit magazine in international semi-conductor industry, focusing on reporting major research achievements and the latest industrial trends in compound and advanced silicon semiconductors.
The team has been devoted in the research of advanced electronic packaging technology, especially in electronic devices heat dissipating, high-reliable packaging technology, and optoelectronic devices packaging technology in recent years. The team has published more than 30 SCI papers that ranked the first 25% in Journal Citation Reports (including 2 ESI Highly Cited Papers and 2 Cover Papers).
Link of the paper: https://doi.org/10.1109/TED.2021.3062314
Link of the column: http://www.semiconductor-today.com/news_items/2021/mar/hust-180321.shtml