Postdoctoral Research Positions
Advanced Electronics Materials and Manufacturing
School of Mechanical Science and Engineering
Huazhong University of Science and Technology
Founded in 1952, the School of Mechanical Science and Engineering is one of the largest and strongest colleges in Huazhong University of Science and Technology(HUST), with 8 academicians of the Chinese Academy of Sciences/Academy of Engineering. Based on the National Key Laboratory at the School of Mechanical Science and Engineering of HUST and related scientific research platforms, Professor Liu Changqing's research group seeks to recruit 2-3 postdoctoral researchers in the areas of advanced electronics materials and manufacturing technology.
1、Professor Liu Changqing
Prof. Liu is a professor and doctoral supervisor at the School of Mechanical Science and Engineering at HUST in China, and an emeritus professor of Loughborough University in the United Kingdom. He has been extensively engaged in innovative research on advanced electronic materials and manufacturing technologies, including IC device heterogeneous integration, interconnection, packaging, interfacial characteristics and bonding mechanisms and reliability analysis; power electronics and Wide-band Gap (WBG) semiconductor integration and packaging; bioelectronics and intelligent wearable and implantable electronics. He has published more than 300 academic articles in international journals and conferences, and collaborated with over 30 universities and research institutions around the world, including Imperial College London, King's College London, University of Nottingham, University of Manchester, Nanyang Technological University of Singapore, City University of Hong Kong, etc., and his research work have attracted an extensive attention and recognition from his international peers, relevant organisations and industries.
Liu Changqing-School of Mechanical Science and Engineering (hust.edu.cn)
2、Description of Research Areas
Heterogeneous integration and packaging of semiconductor devices: electronic packaging materials and preparation; copper interconnection and its application; interface characteristics, mechanical behavior and reliability of electronic interconnection; "green" sustainable electronics manufacturing.
Electronic interconnect materials and manufacturing in harsh environments: high-temperature interconnect materials, manufacturing and application; low-temperature electronic interconnect materials and preparation; reliability analysis and failure mechanism in thermal-electric-mechanical coupled harsh environments.
Wide-band Gap (WBG) semiconductor integration、interconnect and thermal management optimization: Advanced Interconnect Materials (AIMs) and processes for die-attach, substrate-attach and optimization in power electronics; high-temperature diffusion barriers, thermal interface material fabrication; and system thermal management optimization.
Heterogeneous integration for bioelectronics and intelligent wearable electronics: bioelectronic interface materials and fabrication; printing/flexible/organic electronics related materials and manufacturing technologies; bio-electronic multi-material multifunctional system integration; 3D additive construction of multifunctional composite bionic tissues.
3、Requirements and Qualifications of Applicants
（1）Applicants should be ideally under the age of 35, have obtained a doctorate degree for no more than 3 years, bearing a rigorous scientific research attitude and good teamwork spirit, see the further details via http://postdoctor.hust.edu.cn/info/1007/2928.htm
（2）Candidates should have a suitable PhD degree in the related science and engineering subjects such as physics and chemistry, materials, and some research experience in electronic materials and manufacturing, Integrated Circuit and device integration and packaging, with a strong theoretical foundation, relevant practical skills, independent scientific research ability, and good team spirit.
（3）Competent English communication and writing skills, being able to actively participate in the activities for set-up of the laboratory and supply relevant training to graduate students.
4、Terms and Conditions
（1）The term of employment of postdoctoral fellows is 2 years, with an annual salary up to 350,000 Chinese Yuan.
（2）During the employment period, postdoctoral fellows can enjoy welfare benefits such as children's enrollment in nurseries, social medical insurance and other social insurance, and can apply for a place in postdoctoral apartments.
（3）The HUST will commit to the strongest supports to the successful candidates by providing sufficient research funds, an excellent research environment and development platform, offering opportunities of attending international conferences and other international research exchange, and helping for the research applications, and those with outstanding performance can be recommended for consideration of an offer of teaching position.
5、Procedures of Application
（1）Curriculum vitae in Chinese and English including basic personal information, academic work experience, participation in scientific research projects, research content of doctoral dissertation, publication of dissertation, etc.
（2）Supporting materials including scanned copy of doctoral degree certificate or online verification report of student status of the Ministry of Education, the first page of the dissertation and no more than 5 representative works).
（3）Two or more letters of recommendation from experts with senior professional titles in the relevant subject field.
（4）Research plan and expected goals during postdoctoral work.
（5）Applicants should put together the above materials into single PDF file and send via email: chenjia617@hust.edu.cnwith the subject indicated as “Postdoctoral application + Applicant’s name”.
（6）The dates and details of interview for shortlisted candidates will be arranged and notified separately.
（7）Deadline: Positions are open to outstanding candidates all the year around.
