From October 17 to 20, 2024, the 1st Asia-Pacific Atomic Layer Deposition (AP-ALD 2024) Conference has been successfully launched in Shanghai. The general chair of the conference is Prof. Rong Chen from School of Mechanical science and engineering, Huazhong University of Science and technology (HUST), and the co-chair is Prof. Soo-Hyun Kim from the Ulsan National Institute of Science and Technology. The event gathered over 300 experts and scholars from Asia-Pacific regions such as China, including Hongkong, Macau and Taiwan, Korea, Japan, Singapore, Vietnam, Australia, as well as experts from the United States, Germany, Finland, Switzerland. This landmark conference filled a crucial gap in the Asia-Pacific region, establishing a vital platform for international collaboration in atomic layer deposition technology and marking a significant milestone in the field’s global advancement.
The conference offered a well-rounded program, featuring plenary sessions, keynote speeches, oral presentations, and poster sessions. Participants shared the latest applications of ALD technology in areas like microelectronics, optoelectronics, energy storage, and catalysis, engaging in in-depth discussions on emerging advancements and future directions in the field.
During the opening ceremony, Prof. Rong Chen welcomed attendees and reviewed the evolution of ALD technology, and emphasized the conference as a leading platform for academic exchange and international collaboration, designed to drive technological innovation and industrial growth. Esteemed speakers included Prof. Hyungjun Kim from Yonsei University, and Mr. Yamato Tonegawa from Tokyo Electron Ltd., who discussed ALD’s practical applications in nanomaterials and highlighted key trends shaping the future of the field.
Total 18 keynote talks and 38 invited lectures, delved into ALD’s pivotal role in the future of manufacturing and other key industries. Young researchers were also well-represented, with 39 delivering oral presentations and 30 showcasing their work in poster sessions. For the poster session, scholars from all over the world participated in live discussions and 10 Best Poster Awards were presented, including three awarded to Weizhen Wang, Haojie Li, and Xuewei Jiang, graduate students from HUST.
Participants offered highly positive feedback on the event’s organization and content. "The conference exceeded my expectations," one attendee remarked. "It provided a unique platform to connect with world-class experts and explore the latest developments in ALD technology." An industry expert added, "The diversity of topics and depth of discussions were truly impressive. I made valuable connections that are sure to lead to future collaborations."
During the conference, Chair and Co-Chair of the 2025 AVS ALD/ALE conference Prof. Han-Bo-Ram Lee, and Prof. Heeyeop Chae has introduced the next global meeting in Jeju Island, South Korea, and invited all Asia-Pacific researchers to join. At the end of the conference, Prof. Rong Chen handed the banner of AP-ALD to the AP-ALD 2026 chair Prof. Soo-Hyun Kim, which marks the successful conclusion of the conference and the continued inheritance and continuous development of the Asia-Pacific Conference on Atomic Layer Deposition.
The conference’s success was largely due to the dedication and hard work of the HUST team. Volunteers, including faculty and students from the State Key Laboratory of Mechanical Engineering, demonstrated exceptional professionalism and commitment, ensuring the event’s smooth execution. Looking ahead, HUST plans to continue advancing research and collaboration in ALD technology, focusing on translating scientific breakthroughs into real-world applications and contributing to global technological progress.
